Removal of the OSP-layer on the lead frame which is necessary to prevent damaging or contamination of the top layer of the lead frames by an additional heating step, to improve adhesion of packaging.
M2i project:
Removal of the OSP-layer using an extra heating step was investigated
Industrial benefits:
An extra heating step was implemented in the production process to ensure removal of the OSP
No extra investment necessary, could be carried out with existing equipment
Minimisation of rejects due to delamination. Estimated reduction of rejects about 10 – 25%