Interface delamination in integrated microsystems
A new Miniaturized Mixed Mode Bending setup (MMMB) was designed and manufactured to test interface delamination, a primary failure mechanism in SIP microsystems, used in telephones and other electronic devices.
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Video: Eindhoven University of Technology (TU/e)
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Demands by the semiconductors industry for high levels of integration, lower costs and a growing need for complete system solutions has led to the emergence of ”System In Package” (SIP) solutions in which ”the package contains the system”.
Since SIP-microsystems have multiple thin and stacked layers manufactured using different processes and materials, internal (intrinsic and/or thermal) mismatch stresses are inevitably present, making interface delamination a primary failure mechanism.
• To develop adequate methodologies for characterization of interfacial properties (e.g. fracture toughness) in SIPs.
• A new Miniaturized Mixed Mode Bending (MMMB) setup which enables in-situ delamination testing was designed and manufactured.
• A step-by-step measurement protocol was formulated and calibration samples were defined.
• This enables Philips to use this facility at TU/e, instead of building their own, saving 60.000 euro.